Multi-Tech MultiConnect xDot MTXDOT-915 Series Developer's Manual

MultiConnect

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xDot

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MTXDOT Developer Guide

CONTENTS

MultiConnect

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MTXDOT Developer Guide 3

Contents

Chapter 1 Product Overview .................................................................................................................................... 6

Overview ....................................................................................................................................................................... 6

Documentation Overview ............................................................................................................................................. 6

Related Documentation.............................................................................................................................................. 6

mbed Documentation ................................................................................................................................................... 6

Programming the xDot Microcontroller ..................................................................................................................... 7

General mBed Links .................................................................................................................................................... 7

xDot Platform ............................................................................................................................................................. 7

EUI and Networking ...................................................................................................................................................... 7

Product Build Options ................................................................................................................................................... 8

Chapter 2 Getting Started ........................................................................................................................................ 9

Getting Started with the xDot Developer Kit................................................................................................................ 9

COM Port Enumeration by Operating System .............................................................................................................. 9

Linux............................................................................................................................................................................ 9

Windows ..................................................................................................................................................................... 9

Mac ........................................................................................................................................................................... 10

Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11

xDot............................................................................................................................................................................. 11

Chapter 4 Specifications and Pin Information ........................................................................................................ 12

MTXDOT Specifications............................................................................................................................................... 12

Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14

Power Draw................................................................................................................................................................. 15

Measuring the Power Draw ...................................................................................................................................... 15

Electrical Characteristics ............................................................................................................................................. 16

xDot and Processor Pin Information .......................................................................................................................... 16

Pin Information ......................................................................................................................................................... 16

Pull-Up/Down............................................................................................................................................................ 19

xDot Pinout Design Notes ........................................................................................................................................... 20

Serial Pinout Notes.................................................................................................................................................... 20

Serial Settings.............................................................................................................................................................. 20

LoRa ............................................................................................................................................................................ 20

Throughput Rates...................................................................................................................................................... 20

Range ........................................................................................................................................................................ 20

Chapter 5 Antennas ............................................................................................................................................... 22

Antenna System ......................................................................................................................................................... 22

U.FL and Trace Antenna Options ............................................................................................................................... 22

Ethertronics Chip Antenna.......................................................................................................................................... 24

CONTENTS

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Antenna Specifications ............................................................................................................................................. 24

Pulse Electronics Antenna........................................................................................................................................... 24

Antenna Specifications ............................................................................................................................................. 24

RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 25

Coaxial Cable Specifications ..................................................................................................................................... 25

OEM Integration ......................................................................................................................................................... 25

FCC & IC Information to Consumers ......................................................................................................................... 25

FCC Grant Notes........................................................................................................................................................ 25

Host Labeling............................................................................................................................................................. 26

Chapter 6 Safety Information................................................................................................................................. 27

Handling Precautions .................................................................................................................................................. 27

Radio Frequency (RF) Safety ....................................................................................................................................... 27

Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 27

Interference with Pacemakers and Other Medical Devices ...................................................................................... 28

Potential interference............................................................................................................................................... 28

Precautions for pacemaker wearers ........................................................................................................................ 28

Device Maintenance ................................................................................................................................................... 28

User Responsibility...................................................................................................................................................... 28

Chapter 7 Regulatory Information ......................................................................................................................... 29

EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 29

47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 29

FCC Interference Notice ............................................................................................................................................. 29

FCC Notice................................................................................................................................................................... 29

Industry Canada Class B Notice................................................................................................................................... 30

Chapter 8 Environmental Notices........................................................................................................................... 31

Waste Electrical and Electronic Equipment Statement .............................................................................................. 31

WEEE Directive.......................................................................................................................................................... 31

Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 31

REACH Statement ....................................................................................................................................................... 32

Registration of Substances........................................................................................................................................ 32

Substances of Very High Concern (SVHC) ................................................................................................................ 32

Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 33

Information on HS/TS Substances According to Chinese Standards ......................................................................... 34

Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 35

Chapter 9 Labels .................................................................................................................................................... 36

Label Examples............................................................................................................................................................ 36

Chapter 10 Developer Kit Overview ....................................................................................................................... 37

xDot Developer Kit ..................................................................................................................................................... 37

Developer Kit Package Contents............................................................................................................................... 37

Firmware Updates..................................................................................................................................................... 37

CONTENTS

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Programming Devices in Production ........................................................................................................................ 37

xDot Developer Kit Mechanical Drawings................................................................................................................... 38

Micro Developer Board LEDs ...................................................................................................................................... 39

Chapter 11 Developer Board Schematics................................................................................................................ 40

Assembly Diagrams and Schematics........................................................................................................................... 40

Assembly Diagrams................................................................................................................................................... 40

Schematics ................................................................................................................................................................ 42

Chapter 12 Design Considerations.......................................................................................................................... 46

Noise Suppression Design........................................................................................................................................... 46

PC Board Layout Guideline ......................................................................................................................................... 46

Electromagnetic Interference .................................................................................................................................... 46

Electrostatic Discharge Control................................................................................................................................... 47

Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 48

Mounting the Device on Your Board .......................................................................................................................... 48

Solder Profile............................................................................................................................................................... 48

Setpoints (Celsius)..................................................................................................................................................... 49

xDot Packing ............................................................................................................................................................... 49

Programming External Targets ................................................................................................................................... 49

JTAG/SWD Connector .............................................................................................................................................. 50

Index...................................................................................................................................................................... 52

CHAPTER 1 PRODUCT OVERVIEW

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Product Build Options

Product Description Package Quantity

North America

MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100

MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100

EMEA

MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100

MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100

Developer Kits

MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot

MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot

Note:

■ The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision

and x is the revision number.

CHAPTER 2 GETTING STARTED

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Chapter 2 Getting Started

Getting Started with the xDot Developer Kit

Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT

Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command

Reference Guide.

Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and

the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which

pins are available out of the box.

Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.

Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/

To send commands to the xDot:

1. Plug the developer board into a USB port.

2. Open communications software, such as TeraTerm, Putty, or Minicom.

3. Set the following:

■ Baud rate = 115,200

■ Data bits = 8

■ Parity = N

■ Stop bits = 1

■ Flow control = Off

To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for

details and links.

For help setting up a MultiConnect

®

Conduit

™

to send data to and from an xDot, refer to Related Documentation .

COM Port Enumeration by Operating System

xDots create an AT Commands port and a debug port.

Linux

The following COM ports are created on Linux systems:

■ /dev/ttyACMx

■ /dev/ttyACMy

Where x and y may be 0 and 1, 3 and 4, etc.

The COM port with lower number is the AT command port and COM port with the higher number is the debug

port.

Windows

On Windows systems, COM ports appear in the Device Manager:

■ Debug Port: mbed Serial Port

CHAPTER 2 GETTING STARTED

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■ AT Command Port: XR21V1410 USB UART

You may need to install a driver for the debug port to function properly. Go to:

https://developer.mbed.org/handbook/Windows-serial-configuration

Mac

On Mac systems, COM ports appear in the Device Manager as:

■ /dev/cu.usbmodemx

Where x is a string of numbers and possibly letters, ending in a number.

The COM port with lower number is the AT command port and COM port with the higher number is the debug

port.

CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS

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Chapter 3 Mechanical Drawings with Pinouts

xDot

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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Chapter 4 Specifications and Pin Information

MTXDOT Specifications

Category Description

General

Compatibility LoRaWAN 1.0 specifications

Interfaces Note that pin functions are multiplexed.

Up to 19 digital I/O

Up to 10 analog inputs

2 DAC outputs

I2C

SPI

Wake pin

Reset pin

Full UART

mbed/simple UART (RX & TX only)

mbed programming interface

CPU Performance

CPU 32 MHz

Max Clock 32 MHz

Flash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available

EEPROM 8 KB, available 6 KB

SRAM 32 KB

Backup Register 128 byte, available 88

Radio Frequency

ISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz

Physical Description

Weight 0.0001 oz. (0.003g)

Dimensions Refer to Mechanical Drawings for Dimensions.

RF Connectors

-UFL Models U.FL

-Trace Models Trace Connection

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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Category Description

Environment

Operating

Temperature

-40° C to +85° C

Storage

Temperature

-40° C to +85° C

Humidity 20%-90% RH, non-condensing

Power Requirements

Operating Voltage 2.4 to 3.57 V

Certifications and Compliance

EMC and Radio

Compliance

EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012

EN 301 489-03 V1.6.1:2013 ICES-003:2012

FCC 15.247:2015 CISPR 22:2008

FCC 15.109:2015 AS/NZS CISPR 22

FCC 15.107:2015 AS/NZS 4268:2012 + a1:2013

RSS 247:2015 Standard 2014 MPE

Safety Compliance UL 60950-1 2nd ED

cUL 60950-1 2nd ED

IEC 60950-1 2nd ED AM1 + AM2

AS/NZS 60950.1:2015

Category Description

Transmission

North America EMEA

Max Transmitter

Power Output (TPO)

19 dBm 14 dBm

Maximum Receive

Sensitivity

-137 dBm -137 dBm

Link Budget

1

147 dB Point-to-Point 147 dB Point-to-Point

Max Effective

Isotropic Radiated

Power (EiRP)

22 dBm 10 dBm

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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Category Description

Receive Sensitivity

Spreading Factor North America Typical Sensitivity

2

EMEA Typical Sensitivity

3

6 -111 dBm -121 dBm

7 -116 dBm -124 dBm

8 -119 dBm -127 dBm

9 -122 dBm -130 dBm

10 -125 dBm -133 dBm

11 -127 dBm -135 dBm

12 -129 dBm -137 dBm

1

Greater link budget is possible with higher gain antenna.

2

RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx

path.

3

RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx

path.

Mapping Data Rate to Spreading Factor/Bandwidth

Uplink Downlink

US/AU DR0: SF10BW125 DR8: SF12BW500

DR1: SF9BW125 DR9: SF11BW500

DR2: SF8BW125 ...

DR3: SF7BW125 DR13: SF7BW500

DR4: SF8BW500

DR5-DR7: RFU

EU DR0: SF12BW125

...

DR5: SF7BW15

DR6: SF7BW250

DR7: FSK

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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Power Draw

Note:

■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source

when determining product load.

■ Power measurements are similar for 868 MHz models. Some 868 MHz sub-band frequencies do not

support maximum TXP power of 20.

■ Transmit power measured with MTXDOT-915-xx transmitting to a MultiConnect Conduit with an

MTAC-LORA-915 accessory card installed.

■ Idle current measured with the xDot joined with Conduit, but idle without data transferring.

■ Transmit power measured while transferring data packets using spread factor 9. Packet size limited

to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run

to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken

during that time.

■ For Inrush charge, recorded the highest observed value from five separate measurements.

Voltage USB = 5v Standby Mode

Current, (Sleep = 0

Deep Sleep)

Stop Mode

Current,

(Sleep = 1)

Idle current

Average

Spreading Factor Setting Packet Size (#

Bytes)

LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 10

LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 53

Voltage USB =

5v

Average Current

(Amps) at Low

Transmit Power

Setting (TXP 2)

Average Current

(Amps) at Default

Transmit Power

Setting (TXP 11)

Average Current

(Amps) at

Maximum

Transmit Power

Setting (TXP 20)

Total Inrush

Charge

measured in

MilliCoulombs

Total Inrush Charge

DURATION during

Powerup (INRUSH

Duration)

LDO = 3.3 0.013 0.017 0.018 0.132mC 153uS

LDO = 3.3 0.017 0.024 0.025 0.132mC 147uS

Measuring the Power Draw

To measure the power draw on an xDot developer board:

1. Flash the latest AT command firmware on the xDot.

2. Unplug the xDot from the computer and then reconnect it.

3. Connect current meter across JP30 on the developer board.

4. Set wake pin to wake, AT+WP=6.

5. Set wake mode to interrupt, AT+WM=1.

6. Put the xDot to sleep, AT+SLEEP=0|1.

7. Put jumper across JP5.

Note: After this step, AT command and debug ports no longer work.

8. Measure current draw.

9. Press the S2 button on the developer board to wake the xDot

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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Electrical Characteristics

Signal Description Min Max

Vin Low Input low level -- 0.3 * VDD

Vin High Input high level 0.45 * VDD +0.6 --

Vout Low Output low level -- .4

Vout High Output high level 0.4 --

VCC Standard operating voltage 2.4 3.6

ICC Operating current (mA)

@5V

-- 135

Operating current (mA)

@3.3V

-- 200

xDot and Processor Pin Information

Pin Information

Note:

■ Using the mbed platform expands your pin functionality options.

■ Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left)

■ The xDot is 0.045 x 0.045, board is 0.93 x 0.93

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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48QFN xDot Pin Pin Name SW Name Function

Description

Processor Pin

Alt1

Processor Pin Alt2

25 9 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/

I2C2_SMBA/

SPI2_NSS/

I2S2_WS/

USART3_CK/

LCD_SEG12

ADC_IN18/

COMP1_INP/

VLCDRAIL2

26 10 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/

SPI2_SCK/

I2S2_CK/

USART3_CTS/

LCD_SEG13

ADC_IN19/

COMP1_INP

28 11 PB15 SPI2_MOSI GPIO / SPI TIM11_CH1/

SPI2_MOSI/

I2S2_SD/

LCD_SEG15

ADC_IN21/

COMP1_INP/

RTC_REFIN

27 12 PB14 SPI2_MISO GPIO / SPI TIM9_CH2/

SPI2_MISO/

USART3_RTS/

LCD_SEG14

ADC_IN20/

COMP1_INP

30 13 PA9 UART1_TX GPIO / UART USART1_TX/

LCD_COM1

-

31 14 PA10 UART1_RX GPIO / UART USART1_RX/

LCD_COM2

-

12 15 PA2 UART2_TX Debug UART

13 16 PA3 UART2_RX Debug UART

20 23 PB2 GPIO3 GPIO BOOT1 VLCDRAIL1/ ADCIN0b

18 24 PB0 GPIO2 GPIO TIM3_CH3/

LCD_SEG5

ADC_IN8/

COMP1_INP/

OPAMP2_VOUT/

VLCDRAIL3/

VREF_OUT

15 25 PA5 GPIO1 GPIO TIM2_CH1_ETR/

SPI1_SCK

ADC_IN5/

DAC_OUT2/

COMP1_INP

14 26 PA4 GPIO0 GPIO SPI1_NSS/

SPI3_NSS/

I2S3_WS/

USART2_CK

ADC_IN4/

DAC_OUT1/

COMP1_INP

45 27 PB8 I2C1_SCL GPIO / I2C TIM4_CH3/

TIM10_CH1/

I2C1_SCL/

LCD_SEG16

-

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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48QFN xDot Pin Pin Name SW Name Function

Description

Processor Pin

Alt1

Processor Pin Alt2

46 28 PB9 I2C1_SDA GPIO / I2C TIM4_CH4/

TIM11_CH1/

I2C1_SDA/

LCD_COM3

-

37 29 PA14 MBED SWCLK JTCK-SWCLK -

34 30 PA13 MBED SWDIO JTMS-SWDIO -

33 31 PA12 UART1_RTS GPIO / UART USART1_RTS/

SPI1_MOSI

USB_DP

32 32 PA11 UART1_CTS GPIO / UART USART1_CTS/

SPI1_MISO

USB_DM

7 33 NRST NRESET - -

10 34 PA0-WKUP1 WAKE GPIO / WAKE TIM2_CH1_ETR/

TIM5_CH1/

USART2_CTS

WKUP1/

RTC_TAMP2/

ADC_IN0/

COMP1_INP

37 ANT1

47 RFU (ANT2)

8,23,35

,47,49

1, 5, 17,

20,35, 36,

38, 39,

40, 41,

42, 43,

44, 45,

46, 48,

49, 50,

51, 52,

53, 54,

55, 56,

57, 58

VSS GND

2, 6, 7, 8,

18, 19,

21, 22

Reserved

16 PA6 LORA_DIO0 LORA Radio

17 PA7 LORA_DIO1 LORA Radio

29 PA8 LORA_DIO2 LORA Radio

42 PB6 LORA_DIO3 LORA Radio

43 PB7 LORA_DIO4 LORA Radio

40 PB4 LORA_MISO LORA Radio

41 PB5 LORA_MOSI LORA Radio

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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48QFN xDot Pin Pin Name SW Name Function

Description

Processor Pin

Alt1

Processor Pin Alt2

38 PA15 LORA_NSS LORA Radio

11 PA1 LORA_RESET LORA Radio

39 PB3 LORA_SCK LORA Radio

22 PB11 SE_CLK Secure Element

19 PB1 SE_CTRL Secure Element

21 PB10 SE_IO Secure Element

2 PC13-WKUP2 SE_RESET Secure Element

44 BOOT0 Boot0 - -

3 PC14-

OSC32_IN(4)

RTC_CLK - OSC32_IN

4 PC15-

OSC32_OUT

RTC_CLK - OSC32_OUT

5 PH0-

OSC_IN(5)

Main 24M - OSC_IN

6 PH1-

OSC_OUT(5)

Main 24M - OSC_OUT

Pull-Up/Down

48QFN xDot Pin Pin Name SW Name PU/PD

7 33 NRST 10k PU

38 PA15 LORA_NSS 100k PU

19 PB1 SE_CTRL 10k PU

44 BOOT0 10k PD

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

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xDot Pinout Design Notes

Refer to the mechanical drawing for your model for pin locations.

■ All pins that go to connectors are directly connected to the processor.

■ Refer to Pin Information table for pull up and pull down information.

xDots allow you to program pins depending on your application:

■ Serial: Available out of the box. See Serial Pinout Notes for details.

■ mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For

more information about processor capabilities, see the processor datasheet.

Serial Pinout Notes

Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model for

pin locations.

■ 18 PTA1 UART1_CTS

■ 19 PTA2 UART1_RTS

■ 36 PTC3 UART1_RX

■ 37 PTC4 UART1_TX

Serial Settings

When creating a serial connection with the device on the developer board, open communications software (such

as TeraTerm, Putty, or Minicom ), and use the following settings:

■ Baud rate = 115,200

■ Data bits = 8

■ Parity = N

■ Stop bits = 1

■ Flow control = Off

LoRa

Throughput Rates

Theoretical maximum speeds for LoRa mode with ACKs off are:

■ Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps).

■ Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).

Note: Data rates in the LoRaWAN specification vary by geographic region.

Range

Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use

the following formula to calculate the maximum range:

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