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MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
MULTICONNECT® DRAGONFLYTM DEVICE GUIDE
2 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
MultiConnect
®
Dragonfly
TM
Device Guide
Models: MTQ-LAT3-B01, MTQ-LAT3-B02
Part Number: S000656 1.3
Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of
Multi-Tech Systems, Inc. All rights reserved. Copyright © 2019 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,
material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and non-
infringement.
Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of
Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.
Trademarks and Registered Trademarks
MultiTech, and the MultiTech logo, MultiConnect, and Dragonfly are trademarks or registered trademarks of Multi-Tech Systems, Inc. All other products
and technologies are the trademarks or registered trademarks of their respective holders.
Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with
applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or
death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life
preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or
missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted
Applications is at the user’s sole risk and liability.
MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE
UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR
COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,
COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR
COMMUNICATIONS NETWORK USING THE PRODUCTS.
The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech
products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into
which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.
MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance
of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written
document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested
changes is performed only as a courtesy and without any representation or warranty whatsoever.
Contacting MultiTech
Knowledge Base
The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.
Support Portal
To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.
Support
Business Hours: M-F, 8am to 5pm CT
Country By Email By Phone
Europe, Middle East, Africa: [email protected] +(44) 118 959 7774
U.S., Canada, all others: [email protected] (800) 972-2439 or (763) 717-5863
Warranty
To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.
World Headquarters
Multi-Tech Systems, Inc.
2205 Woodale Drive, Mounds View, MN 55112
Phone: (800) 328-9717 or (763) 785-3500
Fax (763) 785-9874
CONTENTS
MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide 3
Contents
Chapter 1 – Product Overview ................................................................................................................................. 6
Overview ....................................................................................................................................................................... 6
Documentation ............................................................................................................................................................. 6
Product Build Options ................................................................................................................................................... 6
Chapter 2 – Mechanical Drawings............................................................................................................................ 7
MTQ-LAT3 Models ........................................................................................................................................................ 7
Processor Model (-B01) .............................................................................................................................................. 7
No Processor Model (-B02)......................................................................................................................................... 8
Chapter 3 – Hardware and Specifications................................................................................................................. 9
Specifications ................................................................................................................................................................ 9
Powering Down Your Device ...................................................................................................................................... 10
40-Pin Connector Definitions...................................................................................................................................... 11
MTQ-xx-B01 .............................................................................................................................................................. 11
MTQ-xx-B02 .............................................................................................................................................................. 12
40-Pin Connector ...................................................................................................................................................... 14
Processor Pin Information (B01 models only) ............................................................................................................ 14
Serial Flash Embedded Memory ............................................................................................................................... 17
Communications Flow................................................................................................................................................. 17
Processor Model (B01).............................................................................................................................................. 17
No Processor Model (B02) ........................................................................................................................................ 18
Electrical Characteristics ............................................................................................................................................. 18
Operating Conditions ................................................................................................................................................ 18
Absolute Maximum Rating........................................................................................................................................ 18
DC Electrical Characteristics...................................................................................................................................... 18
Input/Output Current Ratings................................................................................................................................... 19
Power Draw................................................................................................................................................................. 19
MTQ-LAT3-B01 (Processor)....................................................................................................................................... 19
MTQ-LAT3-B02 (No Processor) ................................................................................................................................. 21
USB Cable Recommendations..................................................................................................................................... 22
Device Reset (Pin 35) .................................................................................................................................................. 22
Device Reset................................................................................................................................................................ 23
Processor Models (B01) ........................................................................................................................................... 23
No Processor Models (B02)....................................................................................................................................... 23
Sleep Mode ................................................................................................................................................................. 23
Installing a SIM Card on a DragonFly ......................................................................................................................... 23
Chapter 4 – Antennas ............................................................................................................................................ 25
External Antenna Option ............................................................................................................................................ 25
CONTENTS
4 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
LTE Antenna Information.......................................................................................................................................... 25
SMA to U.FL Cables ..................................................................................................................................................... 26
Connecting an Antenna through the Developer Board Connectors........................................................................... 26
Antenna Diversity........................................................................................................................................................ 27
Placing External Antennas ........................................................................................................................................ 27
Placing GPS Antennas .............................................................................................................................................. 28
Selecting Antennas ................................................................................................................................................... 28
Antenna Approvals and Safety Considerations ........................................................................................................ 28
Diversity and Power Draw ....................................................................................................................................... 28
OEM Integration ......................................................................................................................................................... 28
FCC & IC Information to Consumers ......................................................................................................................... 28
FCC Grant Notes........................................................................................................................................................ 28
Host Labeling............................................................................................................................................................. 29
Chapter 5 – Safety Information .............................................................................................................................. 30
Handling Precautions .................................................................................................................................................. 30
Radio Frequency (RF) Safety ....................................................................................................................................... 30
Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 30
General Safety............................................................................................................................................................. 31
Interference with Pacemakers and Other Medical Devices ...................................................................................... 31
Potential interference............................................................................................................................................... 31
Precautions for pacemaker wearers ........................................................................................................................ 31
Vehicle Safety.............................................................................................................................................................. 31
Device Maintenance ................................................................................................................................................... 32
User Responsibility...................................................................................................................................................... 32
Chapter 6 – Getting Started with the MTQ-LAT3-B01............................................................................................. 33
Developing with an MTQ in Mbed.............................................................................................................................. 33
MTSCellularInterface Library .................................................................................................................................... 33
Mbed
TM
Documentation.............................................................................................................................................. 33
Programming the MTQ Microcontroller ................................................................................................................... 33
Mbed Links................................................................................................................................................................ 34
MTQ Platform .......................................................................................................................................................... 34
ST Microelectronics STM32F411xC/E ........................................................................................................................ 34
Known Issues .............................................................................................................................................................. 34
Chapter 7 – Labels.................................................................................................................................................. 36
Approvals and Certifications....................................................................................................................................... 36
Example Labels............................................................................................................................................................ 36
Chapter 8 – Regulatory Information....................................................................................................................... 37
47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 37
FCC Interference Notice............................................................................................................................................ 37
FCC Grant ................................................................................................................................................................. 37
Industry Canada Class B Notice................................................................................................................................... 39
CONTENTS
MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide 5
Canadian Limitations................................................................................................................................................. 40
Industry Canada ........................................................................................................................................................ 41
Chapter 9 – Environmental Notices........................................................................................................................ 44
Waste Electrical and Electronic Equipment Statement .............................................................................................. 44
WEEE Directive.......................................................................................................................................................... 44
Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 44
REACH Statement ....................................................................................................................................................... 44
Registration of Substances........................................................................................................................................ 44
Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 44
Chapter 10 – Using Connection Manager ............................................................................................................... 46
Installing Connection Manager ................................................................................................................................... 46
Setting Up a Serial Device in Windows Device Manager............................................................................................ 47
Connecting a Device.................................................................................................................................................... 49
Uninstalling Connection Manager............................................................................................................................... 50
Connection Manager User Interface........................................................................................................................... 50
Main tab.................................................................................................................................................................... 51
Settings tab ............................................................................................................................................................... 52
Connection tab.......................................................................................................................................................... 52
Details tab ................................................................................................................................................................. 52
Terminal tab.............................................................................................................................................................. 52
Charts tab.................................................................................................................................................................. 52
Troubleshooting.......................................................................................................................................................... 52
Serial COM port is not available in the Serial Modem Settings................................................................................ 52
Device is not detected ("No Device") ....................................................................................................................... 52
MultiConnect Cell USB Modem is not detected ....................................................................................................... 53
Connection Manager is not working, and a device connected to the computer is not detected............................ 53
Connection Manager displays "Device Error" status for a serial device .................................................................. 53
Index...................................................................................................................................................................... 54
PRODUCT OVERVIEW
6 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
Chapter 1 – Product Overview
Overview
The Dragonfly
TM
(MTQ) cellular system-on-module (SoM) is a ready-to-integrate processing and communications
device that offers developers the functionality of a SoM with the convenience of an onboard cellular radio all in
one compact design. Models with the integrated ARM
®
Cortex
®
-M4 processor allow developers to host their
application and have access to a full suite of interfaces for connecting sensors or other remote assets. Dragonfly
features an ARM mbed
TM
compatible software library for faster development. All Dragonfly software is Open
Source.
Documentation
The following documentation is available at www.multitech.com.
Document Description Part Number
Device Guide This document. Provides model specifications and developer
information.
S000656
Universal Developer Kit 2.0
Developer Guide
Provides information on using the developer board with the
MTQ.
S000610
USB Driver Installation Guide Provides steps for installing USB drivers. S000616
Telit LE910 V2 Series AT
Commands Reference Guide
Provides AT commands and parameters used to configure
your device, used with firmware version 17.00.5x3.
80446ST10707A
Rev 2
Note: If using the MTQ-LAT3-B01 model, additional documentation is available on the mbed site and at
www.multitech.net. See Chapter 6, Getting Started for details.
Product Build Options
Product Description Region
MTQ-LEU7-BO2 LTE Cat 4 Europe
MTQ-LEU7-BO1 LTE Cat. 4 - SOM Version Eurpoe
Note:
These units ship without network activation. To connect them to the cellular network, you need SIM cards
from your service provider.
The complete product code may end in .Rx. For example, MTQ-LEU-B01.Rx, where R is revision and x is the
revision number.
All builds can be ordered individually or in 50-packs.
MECHANICAL DRAWINGS
MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide 7
Chapter 2 – Mechanical Drawings
MTQ-LAT3 Models
Processor Model (-B01)
MECHANICAL DRAWINGS
8 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
No Processor Model (-B02)
HARDWARE AND SPECIFICATIONS
MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide 9
Chapter 3 – Hardware and Specifications
Specifications
Category Description
General
Standards LTE FDD Cat 1, 3GPP release 9 compliant
HSPA+ 21 fallback
SMS is based on CS/Packet-Switched (PS) domain of GSM and WCDMA
USB Interface is CDC-ACM compliant
Frequency Bands 4G: 700 (B12/B13)/850 (B5)/AWS 1700 (B4)/1900 (B2)
3G: 850 (B5)/1900 (B2)
LED One, link status
Speed
Data Speed LTE: 10 Mbps downlink/5 Mbps uplink
HSPA+: Up to 21.0 Mbps downlink/5.76 Mbps uplink
Interface
USB Interface Micro USB 2.0 high speed
1
UART B01 models: Full UART to processor, then RX, TX, RTS, CTS only between the processor
and radio
B02 Models: Full UART
Serial Modem Interface Up to 921.6 Kbps
Storage
Serial Flash SPI bus compatible serial 16Mb flash memory
Physical Description
Weight 0.6 oz (17g)
Dimensions Refer to Mechanical Drawings for details.
Connectors
Antenna 2 surface mount U.FL: cellular, auxiliary
SIM Holder 1.8 V and 3 V micro
Pin header 40-pin female for USB or UART
Environment
Operating
Temperature
3
-40° C to +85° C
4
Storage Temperature -40° C to +85° C
HARDWARE AND SPECIFICATIONS
10 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
Category Description
Humidity 20%-90% RH, non-condensing
Category Description
Power Requirements
Operating Voltage 5 V +/- 5%
Input Current See Power Draw
Certifications and Compliance
EMC and Radio
Compliance
FCC Part 15 Class B
FCC Part 22
FCC Part 24
Safety Compliance UL/cUL 60950-1 2nd Edition
1
mbed has limited USB support for the processor. Software controls routing to processor or directly to radio.
2
The battery management circuit is designed for single cell Li-Ion/Li-Poly technology. Acceptability of the battery
charge circuit for charging specific batteries/cells is to be determined in the end product.
3
Radio performance may be affected by temperature extremes. This is normal.
4
Device has been tested up to +85° C. UL Recognized @ 85° C.
Note: Acceptability of the battery charge circuit for charging specific batteries/cells is to be determined in the
end product.
Powering Down Your Device
CAUTION: Failing to properly power down the device before removing power may corrupt your device's file
system.
To properly power down your device, use the following sequence or pull 3G_ONOFF signal low:
1. Issue the AT#SHDN command.
2. Wait 30 seconds.
3. Power off or disconnect power.
Note: If you send AT#SHDN and do not remove power AND the 3G_ONOFF line is high, the radio restarts after
60 seconds.
HARDWARE AND SPECIFICATIONS
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®
Dragonfly
TM
MTQ-LAT3 Device Guide 11
40-Pin Connector Definitions
MTQ-xx-B01
Pin Signal Name Logic Level Voltage
1
In/Out Description
1 DBX_TX 3V O ST Micro UART debug Tx output
2 SWCLK 3V I See ST Microcontroller Guide
3 CHARGE_MON 0 - VCC-IN O Open-drain charging status
indication output
4 PWR_GOOD 0 - VCC-IN O Open-drain power good status
indication output
5 GND GND GND Ground
6 USB-DATA+ 0 - 3V
2
7 USB-DATA-
8 VCC-IN 4.35 - 5.25 Power Input Main Power
9 IO_00 I = 0 - 7V, O = 0 - 3V I/O General Purpose I/O from ST
Microcontroller (STM 32F411)
10 IO_01
11 IO_02
12 IO_03
13 GND GND GND Ground
HARDWARE AND SPECIFICATIONS
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MTQ-LAT3 Device Guide
Pin Signal Name Logic Level Voltage
1
In/Out Description
14 IO_04 I = 0 - 7V, O = 0 - 3V I/O General Purpose I/O from ST
Microcontroller (STM 32F411)
15 IO_05
16 IO_06
17 IO_07
18 IO_08
19 IO_09
20 IO_10
21 IO_11
22 IO_12
23 IO_13
24 IO_14
25 IO_15
26 IO_16
27 IO_17
28 GND GND GND Ground
29 IO_18 I = 0 - 7V, O = 0 - 3V I/O General Purpose I/O from ST
Microcontroller (STM 32F411)
30 IO_19
31 IO_20
32 IO_21
33 VCC-IN 4.35 - 5.25 Power Input Main Power
34 LINK_STATUS 3V O Radio link status LED
35 RESET 0 - 3V I NRST pin of ST micro
36 GND GND GND Ground
37 GND
38 SWO 3V O See ST Microcontroller Guide
39 SWDIO 3V I
40 DBG_RX 3V I ST Micro UART debug Tx input
1
A hyphen (-) indicates a range of acceptable logic levels.
2
USB D+D-: 5V tolerant inputs / 3V drive-level output
MTQ-xx-B02
Pin Signal Name Logic Level Voltage
1
Max
Voltage
In/Out Description
1 N/C
HARDWARE AND SPECIFICATIONS
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®
Dragonfly
TM
MTQ-LAT3 Device Guide 13
Pin Signal Name Logic Level Voltage
1
Max
Voltage
In/Out Description
2 N/C
3 N/C
4 PWR_GOOD 0- VCC-IN O Open-drain power good status
indication output
5 GND GND GND Ground
6 USB-DATA+ 0 - 3V 5.5V I/O USB Data
7 USB-DATA-
8 VCC-IN 4.35V - 5.25V Power Input Main Power
9 RADIO_RXD 0 - 3V 3.3V O
10 RADIO_DCD 0 - 3V 3.3V O Data carrier detect
11 RADIO_RI 0 - 3V 3.3V O Ring indicator
12 RADIO_CTS 0 - 3V 3.3V O Clear to send (flow control)
13 GND GND GND Ground
14 SPI_MOSI
1
0 - 3V 3.3V O
15 SPI_SCLK
1
0 - 3.3V 3.3V I SPI clock
16 SPI_CS1
1
0 - 3.3V 3.3V I Serial flash SPI CS
17 N/C
18 N/C
19 N/C
20 N/C
21 N/C
22 N/C
23 N/C
24 N/C
25 SPI_SRDY I = 0 - 3.3V, O = 0 - 3V 3.3V I/O SPI Ready
26 SPI_MISO 0 - 3.3V 3.3V I
27 SPI_CS2
1
0 - 3.3V 3.3V I Radio SPI CS
28 GND GND GND Ground
29 RADIO_RTS 0 - 3.3V 3.3V I Request to send (flow control)
30 RADIO_DSR 0 - 3V 3.3V O Data set ready
31 RADIO_DTR 0 - 3.3V 3.3V I DTE ready
32 RADIO_TXD 0 - 3.3V 3.3V I Serial data input from DTE
33 VCC-IN 4.35 - 5.25V Power Input Main Power
HARDWARE AND SPECIFICATIONS
14 MultiConnect
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MTQ-LAT3 Device Guide
Pin Signal Name Logic Level Voltage
1
Max
Voltage
In/Out Description
34 LINK_STATUS 3V O Radio link status LED
35 RESET 0 - 3V I Radio reset
36 GND GND GND Ground
37 GND
38 N/C
39 N/C
40 N/C
1
For -B02 models only: Pins 14, 15, 16, and 27 are part of the SPI interface. These pins are inputs. If you do not use
them, connect them externally to a high level signal (preferably through a high pull-up resistor) to keep them from
floating.
40-Pin Connector
Manufacturer: Hirose Electric Co LTD
Description: Plug
Model Number: DF17(2.0)-40DP-0.5V(57)
Processor Pin Information (B01 models only)
Note: Diagram from the STMicro 32F411 datasheet.
The following table lists the processor pins and how the MTQ uses them.
HARDWARE AND SPECIFICATIONS
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Dragonfly
TM
MTQ-LAT3 Device Guide 15
Net Name Number Pin Name Details
VDD3_3 1 VBAT Power
3G_ONOFF 2 PC13 Enable line to the Radio
32K_XTAL_ 3 PC14 RTC Clock
32K_XTAL 4 PC15 RTC Clock
26MHZ_CLK_IN 5 PH0-OSC_IN Main Clock
26MHZ_CLK_DRIVE 6 PH1-OSC_OUT Main Clock
N_RESET 7 NRST External Reset in
IO_10 8 PC0 GPIO/Analog capable pin
IO_11 9 PC1 GPIO/Analog capable pin
IO_8 10 PC2 GPIO
RADIO_PWR 11 PC3 Voltage enable for Telit
GND 12 VSSA Power
VDD3_3 13 VDDA Power
IO_18/RTS 14 PA0 GPIO/Analog capable pin/USART2_CTS
IO_03/CTS 15 PA1 GPIO/Analog capable pin/USART2_RTS
IO_00/RXD 16 PA2 GPIO/USART2_TX
IO_21/TXD 17 PA3 GPIO/USART2_RX
GND 18 VSS_4 Power
VDD3_3 19 VDD_4 Power
SPI-SS1 20 PA4 SPI1 Select
IO_05/SCK 21 PA5 SPI1 Clock/GPIO
IO_16/MISO/SDIO_CM
D
22 PA6 SPI1 MSIO/SDIO_CMD /GPIO
IO_01/DCD 23 PA7 GPIO
IO_12 24 PC4 GPIO/Analog capable pin
VDD1_8_MON 25 PC5 Power
IO_9 26 PB0 GPIO/Analog capable pin
IO_02/RI 27 PB1 GPIO
BOOT1/BC_NCE 28 PB2 Battery charge enabled. Pulled down by default.
RADIO_RTS 29 PB10 Serial comm with the radio
VCAP 30 PB11/VCAP_1 Power
N16612690 31 VCAP_1/VSS Power
VDD3_3 32 VDD_1 Power
HARDWARE AND SPECIFICATIONS
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MTQ-LAT3 Device Guide
Net Name Number Pin Name Details
RADIO_CTS 33 PB12 Serial comm with the radio
IO_13 34 PB13 GPIO
SPI-SS2 35 PB14 GPIO for use with external SPI
IO_7 36 PB15 GPIO/SDIO_CK
RADIO_TXD 37 PC6 Serial comm with the radio
RADIO_RXD 38 PC7 Serial comm with the radio
IO_17/SS2/SDIO_D0 39 PC8 GPIO/SDIO_D0
IO_14/SDIO_D1 40 PC9 GPIO/SDIO_D1
IO_20/DTR 41 PA8 GPIO
IO_19/DSR 42 PA9 GPIO/SDIO_D2
USB_DIR/VBUS 43 A10 USB Switch control, 0=Telit, 1=STM
FS_DM 44 PA11 USB
FS_DP 45 PA12 USB
J_TMS /SWDIO 46 PA13 JTAG
47 VCAP_2/VSS Power
VDD3_3 48 VDD_2 Power
J_TCK/SWCLK 49 PA14 JTAG
J_TDI/C_MON 50 PA15 JTAG
SPI-SCK 51 PC10 EPROM/SPI3_SCK
SPI-MISO 52 PC11 EPROM/SPI3_MISO
SPI-MOSI 53 PC12 EPROM/SPI3_MOSI
SPI-SRDY 54 PD2 EPROM/SPI3_SRDY
J_TDO/SWO 55 PB3 JTAG
J_RST/P_GOOD 56 PB4 JTAG
IO_4/MOSI/SDIO_D3 57 PB5 GPIO/SPI1_MOSI/SDIO_D3
DBG_TX 58 PB6 JTAG
DBG_RX 59 PB7 JTAG
BOOT 60 BOOT0 Reserved.
IO_6/SCL/SS1 61 B8 GPIO/I2C1_SCL
IO_15/SDA/SRDY 62 PB9 GPIO/I2C1_SDA
GND 63 VSS_3 Power
VDD3_3 64 VDD_3 Power
HARDWARE AND SPECIFICATIONS
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®
Dragonfly
TM
MTQ-LAT3 Device Guide 17
Serial Flash Embedded Memory
The M25P16 is a 16Mb (2Mb x 8) serial flash memory device with write protection mechanisms accessed by a SPI-
compatible bus.
The serial flash is accessible via the processor pinout on B01 devices. Features include:
75 MHz clock frequency (maximum)
Page program (up to 256 bytes) in 0.64ms (TYP)
Erase capability
Sector erase: 512Kb in 0.6 s (TYP)
Bulk erase: 16Mb in 13 s (TYP)
Write protection
Hardware write protection (protected area size defined by non-volatile bits BP0, BP1, BP2)
Deep power down: 1µA (TYP)
Electronic signature
JEDEC standard 2-byte signature (2015h)
Unique ID code (UID) and 16 bytes of read-only data available upon customer request
RES command, one-byte signature (14h) for backward compatibility
More than 100,000 write cycles per sector
More than 20 years of data retention
Communications Flow
Processor Model (B01)
Note:
The B01 has a UART subset as well as GPIO (4 pin UART (tx/rx/rts/cts)
If needed, use the GPIOs for additional UART signaling.
The USB port can switch between a connection to the radio or a connection to the processor. The
USB selection is controlled via programming on the processor. There is no USB between the radio
and the processor.
HARDWARE AND SPECIFICATIONS
18 MultiConnect
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MTQ-LAT3 Device Guide
No Processor Model (B02)
Note: B02 provides a full UART interface as well as a USB interface.
Electrical Characteristics
Operating Conditions
Parameter Minimum Volts Maximum Volts
Supply Range - Vcc 4.35 5
Absolute Maximum Rating
Parameter Minimum Volts Maximum Volts
Voltage at any signal pin -0.3 5.5
DC Electrical Characteristics
Parameter Conditions Minimum Volts Maximum Volts
Digital signal input low level CMOS port
I
IO
=+8 mA
-0.3 0.9
Digital signal input high level CMOS port
I
IO
=+8 mA
2.1 5.5
Output low level voltage for an I/O pin CMOS port
I
IO
=+8 mA
- 0.4
Output high level voltage for an I/O pin V
DD
-0.4 -
Output low level voltage for an I/O pin TTL port
I
IO
=+8 mA
- 0.4
Output high level voltage for an I/O pin 2.4 -
Output low level voltage for an I/O pin I
IO
=+20 mA - 1.3
(1)
Output high level voltage for an I/O pin V
DD
-1.3
(1)
-
Output low level voltage for an I/O pin I
IO
=+6 mA - 0.4
(1)
Output high level voltage for an I/O pin V
DD
-0.4
(1)
-
Output low level voltage for an I/O pin I
IO
=+4 mA - 0.4
(2)
Output high level voltage for an I/O pin V
DD
-0.4
(2)
-
RESET (low active) input low CMOS port
I
IO
=+8 mA
- 0.99
HARDWARE AND SPECIFICATIONS
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MTQ-LAT3 Device Guide 19
Parameter Conditions Minimum Volts Maximum Volts
RESET (low active) input high CMOS port
I
IO
=+8 mA
2.31 -
(1) Guaranteed by characterization results, not tested in production.
(2) Guaranteed by design, not tested in production.
Note:
See the ST Microcontroller data sheet (STM 32F411REF) and the Pin Connector Definitions table in Chapter
3 of this guide.
Use V
DD
= 3.0V when referencing the STM 32F411REF data sheet.
Input/Output Current Ratings
Output current draw PWR_GOOD, CHG_MON 5 mA
Output current draw all other output pins 25 mA
Power Draw
MTQ-LAT3-B01 (Processor)
Radio
Protocol
Sleep Mode Cellular
Connection Idle
(No Data)
(AVG) Measured
Current at Max
Power
1
TX Pulse
2
(AVG)
Amplitude Current for
Peak Current for
HSDPA/LTE)
Total Inrush
Charge
3
Measured
in Millicoulombs
5 Volts WITH Unit in developer card
WCDMA 5 mA 56 mA 655 mA 748 mA 3.21 mC
LTE 5 mA 58 mA 540 mA 608 mA 3.21 mC
5 Volts WITHOUT Unit in developer card
WCDMA 5 mA 62 mA 715 mA 808 mA 3.45 mC
LTE 5 mA 62 mA 555 mA 624 mA 3.45 mC
1
Maximum Power: The continuous current during maximum data rate with the radio transmitter at
maximum power.
2
Tx Pulse: The average peak current during a GSM850 transmission burst period or HSDPA/LTE
connection. The transmission burst duration for GSM850 can vary, depending on what transmission
scheme is being deployed (GPRS Class 8, Class 10, GSM, etc.).
3
Inrush Charge: The total inrush charge at power on.
HARDWARE AND SPECIFICATIONS
20 MultiConnect
®
Dragonfly
TM
MTQ-LAT3 Device Guide
Waveforms
USB only inrush charge of 3.45 mC with 37.2 mS duration
Total Inrush charge of 3.21 mC with 41.1 mS duration
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