Adlink DLAP-211-Orin Series Le manuel du propriétaire

DLAP-211-Orin Series

Edge Inference System

User’s Manual

Manual Rev.: 0.1

Revision Date: December 13, 2023

Part No: 50M-45103-1000

ii Revision History

Revision History

Revision Release Date Description of Change(s)

0.1 2023-12-13 Preliminary release

Preface iii

DLAP-211-Orin Series

Preface

This document contains proprietary information protected by copy-

right. All rights are reserved. No part of this manual may be repro-

duced by any mechanical, electronic, or other means in any form

without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior

notice in order to improve reliability, design, and function and does

not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, spe-

cial, incidental, or consequential damages arising out of the use or

inability to use the product or documentation, even if advised of

the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global

environmental preservation through compliance with the Euro-

pean Union's Restriction of Hazardous Substances (RoHS) direc-

tive and Waste Electrical and Electronic Equipment (WEEE)

directive. Environmental protection is a top priority for ADLINK.

We have enforced measures to ensure that our products, manu-

facturing processes, components, and raw materials have as little

impact on the environment as possible. When products are at their

end of life, our customers are encouraged to dispose of them in

accordance with the product disposal and/or recovery programs

prescribed by their nation or company.

Trademarks

Product names mentioned herein are used for identification pur-

poses only and may be trademarks and/or registered trademarks

of their respective companies.

iv Preface

Conventions

Take note of the following conventions used throughout this

manual to make sure that users perform certain tasks and

instructions properly.

NOTE:

Additional information, aids, and tips that help users perform

tasks.

CAUTION:

Information to prevent minor physical injury, component dam-

age, data loss, and/or program corruption when trying to com-

plete a task.

Informations destinées à prévenir les blessures corporelles

mineures, les dommages aux composants, la perte de don-

nées et/ou la corruption de programme lors de l'exécution

d'une tâche.

WARNING:

Information to prevent serious physical injury, component

damage, data loss, and/or program corruption when trying to

complete a specific task.

Informations destinées à prévenir les blessures corporelles

graves, les dommages aux composants, la perte de données

et/ou la corruption de programme lors de l'exécution d'une

tâche spécifique.

v

DLAP-211-Orin Series

Table of Contents

Revision History...................................................................... ii

Preface .................................................................................... iii

List of Tables......................................................................... vii

List of Figures ........................................................................ ix

1 Introduction ........................................................................ 1

1.1 Features............................................................................... 1

1.2 Specifications....................................................................... 2

1.3 Mechanical Dimensions....................................................... 5

1.4 External Layout.................................................................... 7

1.5 Pin Definitions.................................................................... 10

1.5.1 Ethernet GbE Connectors ........................................ 10

1.5.2 USB 3.0 Connectors................................................. 11

1.5.3 12V DC Connector ................................................... 11

1.5.4 Controller Area Network (CAN) Bus ......................... 12

1.5.5 COM Port.................................................................. 12

1.5.6 HDMI Connectors ..................................................... 13

1.5.7 USB 2.0 OTG Connector.......................................... 13

1.5.8 D-sub 37-pin Connector ........................................... 14

1.5.9 Side I/O Slots............................................................ 15

2 Getting Started ................................................................. 17

2.1 Unpacking Checklist .......................................................... 17

2.2 Cooling Considerations...................................................... 17

2.3 Removing the Chassis Cover ............................................ 18

2.4 Installing an M.2 SSD Module ........................................... 20

2.5 Installing a Mini PCIe Wi-Fi Module................................... 21

2.6 Connecting DC Power ....................................................... 22

vi

2.7 VESA Mount ...................................................................... 24

2.8 DIN Rail Mount................................................................... 25

2.9 AT Power Mode Switch (SW4) .......................................... 26

3 Using the System.............................................................. 27

3.1 Software Configuration ...................................................... 27

3.2 System Recovery............................................................... 27

3.3 COM Port Configuration..................................................... 29

3.4 CAN Bus ............................................................................ 29

3.5 SPI, I2C, and Relay Configuration ..................................... 30

3.5.1 GPIO......................................................................... 30

3.5.2 SPI, I2C, Relay ......................................................... 31

Important Safety Instructions............................................... 33

Getting Service ...................................................................... 37

List of Tables vii

DLAP-211-Orin Series

List of Tables

Table 1-1: Specifications ............................................................. 2

Table 1-2: Front Panel I/O Connectors & Controls ...................... 8

Table 1-3: Rear Panel I/O Connectors ........................................ 9

Table 1-4: NX/TX2NX/Nano Module & I210 LAN LED .............. 10

Table 1-5: RJ45 GbE Pin Definition........................................... 10

Table 1-6: USB 3.0 Pin Definition .............................................. 11

Table 1-7: CAN Bus Pin Definition............................................. 12

Table 1-8: RS-232/422/485 Connector Pin Definition................ 12

Table 1-9: HDMI Connector Pin Definition................................. 13

Table 1-10: USB 2.0 OTG Connector Pin Information................. 13

Table 1-11: D-sub 37-pin Pin Definition....................................... 14

Table 2-1: AT Mode Switch Configuration ................................. 26

Table 3-1: COM Port Names ..................................................... 29

Table 3-2: DLAP-211-Orin GPIO Map Table ............................. 30

Table 3-3: DLAP-211-Orin GPIO Map Table ............................. 31

viii List of Tables

This page intentionally left blank.

List of Figures ix

DLAP-211-Orin Series

List of Figures

Figure 1-1: DLAP-211-Orin NX / Nano Front View ....................... 5

Figure 1-2: DLAP-211-Orin NX / Nano Side View ........................ 5

Figure 1-3: DLAP-211-Orin NXS / NanoS Front View .................. 6

Figure 1-4: DLAP-211-Orin NXS / NanoS Side View.................... 6

Figure 1-5:

Figure 1-6:

DLAP-211-Orin NXS / NanoS Front Panel I/O

Connectors 1 ..............................................................7

DLAP-211-Orin NXS / NanoS Front Panel I/O

Connectors 2 ..............................................................7

Figure 1-7: Rear Panel I/O Connectors ........................................ 9

Figure 1-8: USIM Side Door........................................................ 15

Figure 2-1: M.2 2242 B Key Slot................................................. 20

Figure 2-2: Mini PCIe Wi-Fi Slot ................................................. 21

Figure 2-3: VESA Mount ............................................................. 24

Figure 2-4: DIN Rail Mount ......................................................... 25

Figure 2-5: AT Power Mode Switch (SW4) ................................. 26

xList of Figures

This page intentionally left blank.

Introduction 1

DLAP-211-Orin Series

1 Introduction

ADLINK’s DLAP-211-Orin Series Edge Inference System lever-

ages the power of NVIDIA® Jetson™Orin NX and Orin Nano mod-

ules to deliver artificial intelleigence (AI) at the edge. The DLAP-

211 Edge AI Platforms with integrated NVIDIA Jetson accelerates

deep learning workloads for object detection, recognition, and

classification suitable for industrial embedded applications such as

medical image processing, logistics automation, autonomous

vehicles, smart retail, and AI NVR.

This fanless system provides a wide variety of industrial I/O and

visual inferencing capabilities in a compact size. The DLAP-211-

Orin also supports reserved AFM connectors for optional I/Os

including GPIO, Relay, I2C, and SPI. With a lockable HDMI dis-

play, two GbE ports, four USB 3.0 ports (plus a USB 2.0 OTG port

for software updates), one COM port, one isolated CAN bus, one

M.2 NVME/SATA for operating system operation (built-in SSD

128GB), a Mini PCIe slot and USIM socket to support wireless

communications such as Wi-Fi, LoRA, and 3G/4G LTE, the DLAP-

211-Orin series enables AI at the edge with exceptional perfor-

mance and convenience while keeping power consumption to a

minimum.

1.1 Features

Deep learning acceleration with NVIDIA® Jetson™ Orin NX /

Nano

Compact fanless system: 148(W) x 105(D) x 52(H) mm

Wide temperature range: -20°C to 70°C

AFM supporting GPIO, Relay, I2C, and SPI interfaces

2Introduction

1.2 Specifications

The DLAP-211-Orin series come in eight versions supporting Jet-

son Orin NX and Orin Nano modules along with different I/O

expansion options.

Model

DLAP-211-

Orin NX(S)

8GB

DLAP-211-

Orin NX(S)

16GB

DLAP-211-

Orin Nano(S)

4GB

DLAP-211-

Orin Nano(S)

8GB

AI Performance 70 TOPS 100 TOPS 20 TOPS 40 TOPS

System

GPU

1024-core NVIDIA Ampere

GPU with

32 Tensor Cores

512-core

NVIDIA

Ampere

architecture

GPU with

16 Tensor

Cores

1024-core

NVIDIA

Ampere

architecture

GPU with

32 Tensor

Cores

CPU

6-core Arm®

Cortex®-

A78AE

v8.2 64- bit

CPU 1.5MB

L2 + 4MB L3

8-core Arm®

Cortex®-

A78AE

v8.2 64-bit

CPU 2MB

L2 + 4MB L3

6-core Arm® Cortex®-

A78AE v8.2 64-bit CPU

1.5MB

L2 + 4MB L3

RAM 8GB 16GB 4GB 8GB

Storage 128GB M.2 2242 PCIe Gen3 x4

OS Linux

Front Panel I/O Ports

Button 1x power, 1x reset, 1x recovery

HDMI 1x lockable

USB 4x USB 3.0 Type-A

Ethernet 2x 10/100/1000 Mbps Ethernet

Expansion I/O 2x I2-C, 2x SPI, 1x UART, 8x GPIO, Relay through

1x 37pin D sub connector

Rear Panel I/O Ports

USB 1x USB 2.0 OTG

Serial Port 1x COM RS-232/422/485

Table 1-1: Specifications

Introduction 3

DLAP-211-Orin Series

CAN Bus 1x 2.0b

Extension Slots

Mini PCIe 1x Mini PCIe slot

M.2 1x M.2 B key 2242 socket

Power Supply

DC Input 12V

AC Input 60W

80W (Orin NX 16GB only)

Mechanical

Dimensions (W

x D x H)

148 x 120 x 52 mm (DLAP-211-Orin NX/Nano)

148 x 120 x 64 mm (DLAP-211-Orin NXS/NanoS)

Weight Gross 1.70 kg / Net 1.01 kg (DLAP-211-Orin NX/Nano)

Gross 1.85 kg / Net 1.16 kg (DLAP-211-Orin NXS/NanoS)

Mounting Wall and VESA (DIN rail optional)

SMA Antenna

Connector 4

Environmental

Operating

Temperature

-20°C to 70°C (system level)

-20°C to 85°C (board level)

Operating

Humidity ~95% @40°C (non-condensing)

Model

DLAP-211-

Orin NX(S)

8GB

DLAP-211-

Orin NX(S)

16GB

DLAP-211-

Orin Nano(S)

4GB

DLAP-211-

Orin Nano(S)

8GB

Table 1-1: Specifications

4Introduction

Storage

Temperature -40°C to 85°C

Vibration Operating 5Grms, 5 to 500 Hz, 3 axes w/ M.2 SSD

Shock Operating 100G, half sine 11 ms duration w/ SD, M.2 SSD

ESD Contact +/- 4kV, Air +/- 8kV

Regulatory CE & FCC class B, (EN61000-6-4/-6-2), CE-LVD & UL by

CB, FCCID

Firmware

WDT WDT Supported

Model

DLAP-211-

Orin NX(S)

8GB

DLAP-211-

Orin NX(S)

16GB

DLAP-211-

Orin Nano(S)

4GB

DLAP-211-

Orin Nano(S)

8GB

Table 1-1: Specifications

Introduction 5

DLAP-211-Orin Series

1.3 Mechanical Dimensions

All dimensions shown in millimeters (mm).

Figure 1-1: DLAP-211-Orin NX / Nano Front View

Figure 1-2: DLAP-211-Orin NX / Nano Side View

148

52.10

105

6Introduction

Figure 1-3: DLAP-211-Orin NXS / NanoS Front View

Figure 1-4: DLAP-211-Orin NXS / NanoS Side View

148

64

105

Introduction 7

DLAP-211-Orin Series

1.4 External Layout

DLAP-211-Orin NXS / NanoS Front Panel

Figure 1-5: DLAP-211-Orin NXS / NanoS Front Panel I/O Connectors 1

DLAP-211-Orin NXS / NanoS Front Panel

Figure 1-6: DLAP-211-Orin NXS / NanoS Front Panel I/O Connectors 2

A

BC D E D F

G

8Introduction

Table 1-2: Front Panel I/O Connectors & Controls

Item Name Description

A Power button

The power button is a non-latched pushbutton

with a blue LED power indicator. Press to power

on/power off the system. The button LED lights up

when the system is turned on. If the system

hangs, pressing and holding the button

continuously for 5 seconds performs a hard

shutdown on the system.

B Recovery button Press this button to force the system into recovery

mode. See Section 3.2 System Recovery.

C Reset button The reset button executes a hard reset on the

system.

DGbE connector

(LAN 1)

GbE from NVIDIA® Jetson™ modules.

See Section 1.5 Pin Definitions.

DGbE connector

(LAN 2)

GbE from Intel® I210.

See Section 1.5 Pin Definitions.

E USB 3.0 See Section 1.5.2 USB 3.0 Connectors.

F DC connector 12V 12V DC screw-type connector.

See Section 1.5.3 12V DC Connector.

GD-sub 37-pin

connector

1x I2C, 1x SPI, 1x UART, 8x GPIO,

1x Relay function

Introduction 9

DLAP-211-Orin Series

Rear Panel

Figure 1-7: Rear Panel I/O Connectors

Table 1-3: Rear Panel I/O Connectors

Item Name Description

H CAN bus CAN 2.0B (backward compatible with 2.0A)

I Serial port COM port (DB-9 connector)

RS-232/422/485 (software programmable)

J HDMI port HDMI 2.0 with lock

K USB 2.0 USB 2.0 OTG (Micro USB)

H I J K

10 Introduction

1.5 Pin Definitions

1.5.1 Ethernet GbE Connectors

The DLAP-211 series comes with two RJ45 connectors:

NVIDIA® Jetson™ modules (LAN 1)

Intel® I210 (LAN 2)

LAN LED connection speed color indicators:

Table 1-4: NX/TX2NX/Nano Module & I210 LAN LED

The following table provides details for the RJ45 GbE pin connec-

tions.

Table 1-5: RJ45 GbE Pin Definition

Active & Link

(Left LED)

Speed

(Right LED)

10 Mbps Yellow (Blinking) N/A

100 Mbps Yellow (Blinking) N/A

1000 Mbps Yellow (Blinking) Green

Pin # 10BASE-T/

100BASE-TX 1000BASE-T

1 TX+ LAN_TX0+

2 TX- LAN_TX0-

3 RX+ LAN_TX1+

4 — LAN_TX2+

5 — LAN_TX2-

6 RX- LAN_TX1-

7 — LAN_TX3+

8 — LAN_TX3-

La page charge ...

Adlink DLAP-211-Orin Series Le manuel du propriétaire

Adlink DLAP-211-Orin Series Le manuel du propriétaire

dans d''autres langues

Documents connexes

Autres documents